CO PACKAGED OPTICS REDEFINING • SANTEC HOLDINGS

DIP packaged optical module

DIP packaged optical module

The body (housing) of a DIP containing an IC chip is usually made from molded plastic or ceramic. The hermetic nature of a ceramic housing is preferred for extremely high reliability devices.

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Is co-packaged optics a type of optical chip

Is co-packaged optics a type of optical chip

CPO, or "Co-Packaged Optics," is an advanced opto-electronic co-packaging technology. It involves co-packaging the optical engine (including lasers, modulators, and other optical components) and a high-performance electrical chip (such as a switch ASIC) on the same substrate. Advanced packaging technologies, such as 3D chiplets hetero-integration and co-packaged optics (CPO), have become crucial for further improving system performance. Currently, most solutions rely on silicon-based technologies, which alleviate some challenges but still face issues such as warpage. The optical links of the future must not only address growing bandwidth requirements but also adhere to constraints related to power consumption, cost, space.

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Long-distance sensing fiber optics

Long-distance sensing fiber optics

Distributed Optical Fiber Sensing (DFOS) transforms standard fiber optic cables into powerful sensors capable of detecting temperature, strain, and acoustic signals at thousands of measurement points over long distances. r intensity variations for measurement, degrading perfor-mance, especially in long distance, high-precision applications. Unlike point sensors, they can measure and provide a continuous spatial distribution of a physical quantity, effectively creating a mapped profile of the parameter of interest.

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