High Temperature Resistance of QSFP-DD Optical Modules for Edge Computing
In this paper, the finite element method is used to conduct thermal modeling and simulation of QSFP-DD module, and the internal temperature field of 200 Gbit/s QSFP-DD Long Range 4 (LR4) optical module in high temperature environment is studied. Higher power (25 Watt) modules for QSFP-DD800 systems must d ssipate this heat effectively to ensure operational performance of the modules. The QSFP-DD is a new package of high-speed pluggable modules whose specifications were released in 2016 and received a lot of attention, and after several modifications, QSFP-DD products became available in 2018. The package's electrical interface has 8 channels and can be used for 200 or 400G. Network operators are looking for cost-optimized optical solutions that provide increased density and reduced power consumption—across high-speed as well as legacy ports—without sacrificing network performance or reliability. In a common POM class Quad Small Form-factor Pluggable (QSFP), for example, power dissipation.
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